The present invention discloses a halogen-free flame-retardant epoxy molding compound and a preparation method thereof, belonging to the technical field of semiconductor packaging materials. Inorganic filler is added into a mixer, sprayed with a coupling agent and stirred uniformly, then crushed modified epoxy resin composition, modified phenolic resin composition, curing accelerator, colorant, ion scavenger and stress absorber are sequentially added into the mixer, and stirred to obtain a uniform premixed powder; the premixed powder is fully kneaded and extruded by a twin-screw extruder to obtain the halogen-free flame-retardant epoxy molding compound. The epoxy molding compound can significantly improve the demolding effect after plastic packaging and reduce surface mottling of cured products, can realize continuous production of 1000 molds, meets the UL94 V-0 flame retardant rating for 1mm epoxy molding compound, has low water absorption while maintaining fluidity during the molding process, and has great application prospects in the field of semiconductor packaging.
Country Code: CN
Application Number: CN202410096740.3
